|Drilling Process in Glass Wafer|
Package can be smaller because:
・Straight hole (not Taper) and the hole size from 0.15mm
・The shorter pitch hole, comparing with sandblasting
・Silicon wafer and anode joining is possible
・The coefficient expansion matches to silicon wafer.
|Our standard-Glass wafer|
|Diameter of glass water||Shape of hole||Diameter of hole||Thickness|
|Less than 200mm||Round,Taper,Square,etc...||0.3mm～5mm||0.15mm～1.2mm|
|* Please contact us about out of the standard.|
|CCD cover glass||filter,backlight,and sensor|
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